MT53E256M32D2DS-053 WT:B vs MT53E128M32D2DS-053 对比

详细并排对比 MT53E256M32D2DS-053 WT:B 出自 Micron Technology 和 MT53E128M32D2DS-053 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT53E256M32D2DS-053 WT:B MT53E256M32D2DS-053 - 8Gb LPDDR4 DRAM 1.866GHz | Micron

MT53E256M32D2DS-053 - 8Gb LPDDR4 DRAM 1.866GHz | Micron

MT53E256M32D2DS-053 WT:B ✓ 量产中
Micron Technology
MT53E128M32D2DS-053 MT53E128M32D2DS-053 - 4Gb LPDDR4/LPDDR4X DRAM | Micron

MT53E128M32D2DS-053 - 4Gb LPDDR4/LPDDR4X DRAM | Micron

MT53E128M32D2DS-053 ✓ 量产中

规格对比

参数 MT53E256M32D2DS-053 WT:B MT53E128M32D2DS-053
品牌 Micron Technology Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $21.90 $3.55
存储器类型 LPDDR4 SDRAM (Mobile DRAM) Mobile LPDDR4 / LPDDR4X SDRAM (unified)
Density 8 Gbit (256M x 32) 4 Gbit
存储组织 256M x 32 128M x 32
数据速率 1866 Mbps/pin (1.866 GHz) 1.866 GHz (1866 Mbps/pin)
Supply Voltage (VDD2/VDDQ) 1.1 V —
Operating Temperature (WT grade) -30C to +85C —
封装 200-ball WFBGA, 10 x 14.5 mm 200-ball WFBGA (10 x 14.5 mm)
安装类型 Surface Mount (BGA) Surface Mount
Self-Refresh Auto self-refresh with built-in temperature sensor —
特性 Auto precharge, write leveling, ZQ calibration —
Bus Width 32-bit —
Peak Bandwidth (per device) approximately 7.46 GB/s (32-bit x 1866 Mbps) —
RoHS 状态 Compliant (per JLCPCB/LCSC listing) Compliant
MSL 等级 [DATA_NEEDED: MSL level] [DATA_NEEDED: moisture sensitivity level]
Access Time / CAS Latency [DATA_NEEDED: CL at 1866 Mbps] —
Refresh Interval [DATA_NEEDED: tREFI specification] —
Package Height [DATA_NEEDED: max package height] —
Speed Grade — -053
VDDQ (LPDDR4X mode) — 0.6 V
VDDQ (LPDDR4 mode) — 1.10 V
VDD — [DATA_NEEDED: VDD supply voltage]
Configuration — DDP (double-die package)
Automotive Variant — MT53E128M32D2DS-053 AUT:A / AAT:A / AIT:A available
工作温度 — [DATA_NEEDED: operating temperature range]
Refresh — [DATA_NEEDED: refresh mode 8x/16x]
Access Type — Synchronous, bank-group burst

数据手册与资源

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